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LM1100 View Datasheet(PDF) - Semtech Electronics LTD.

Part Name
Description
Manufacturer
LM1100
Semtech-Electronics
Semtech Electronics LTD. Semtech-Electronics
LM1100 Datasheet PDF : 2 Pages
1 2
LM120 THRU LM1100
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Reverse Voltage - 20 to 100 V
Forward Current - 1 A
Features
• High current capability
• High surge current capability
• Low forward voltage drop
• For use in low voltage, high frequency inverters
free wheeling ,and polarity protection applications
Mechanical Data
• Case: MiniMELF (DO-213AA), molded plastic body
• Terminals: Solder plated, solderable per MIL-STD-750,
method 2026
• Polarity: Color band denotes cathode end
• Mounting Position: Any
MiniMELF (DO-213AA) Plastic Package
Absolute Maximum Ratings and Characteristics
Ratings at 25 OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive
load. For capacitive load, derate current by 20%.
Parameter
Symbols LM120 LM130 LM140 LM150 LM160 LM180 LM1100 Units
Maximum Recurrent Peak Reverse Voltage
VRRM 20 30 40 50 60 80 100 V
Maximum RMS Voltage
VRMS
14 21 28 35 42 56 80
V
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
0.375" (9.5 mm) Lead Length
Peak Forward Surge Current 8.3 ms Single Half
Sine-Wave Superimposed on Rated Load (JEDEC
Method)
VDC
IF(AV)
IFSM
20 30 40 50 60 80 100 V
1
A
40
A
Maximum Forward Voltage at 1 A and 25 OC
VF
Maximum Reverse Current
at Rated DC Blocking Voltage
TA = 25 OC
TA = 100 OC
IR
Typical Junction Capacitance 1)
CJ
Typical Thermal Resistance 2)
RθJA
0.55
0.7
0.85
V
0.5
mA
10
110
pF
75
OC/W
Operating Junction Temperature Range
Tj
- 55 to + 125
- 55 to + 150
OC
Storage Temperature Range
Tstg
- 55 to + 150
OC
1) Measured at 1 MHz and applied reverse voltage of 4 VDC.
2) Thermal resistance junction to ambient 0.24" X 0.24"(6 X 6 mm) copper pads to each terminals
SEMTECH ELECTRONICS LTD.
(Subsidiary of Sino-Tech International Holdings Limited, a company
listed on the Hong Kong Stock Exchange, Stock Code: 724)
®
Dated : 12/02/2009
 

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