M464S3254JUS View Datasheet(PDF) - Samsung

Part Name

Description

Manufacturer

M464S3254JUS

SDRAM Product Guide

Samsung 

General Information

SDRAM

D. SDRAM Module Ordering Information

12

3

4

5

6 7 8 9 10

11

12

MXXXSXXXXXXX-XXX

Memory Module

DIMM Configuration

Data bits

Feature

Depth

Refresh, # of Banks in Comp. & Interface

Speed

Power

PCB revision & Type

Package

Component Revision

Composition Component

1. Memory Module : M

2. DIMM Configuration

3 : DIMM

4 : SODIMM

3. Data Bits

63 : x63 PC100 / PC133 µSODIMM

with SPD for 144pin

64 : x64 PC100 / PC133 SODIMM

with SPD for 144pin (Intel/JEDEC)

66 : x64 Unbuffered DIMM

with SPD for 144pin/168pin (Intel/JEDEC)

74 : x72 /ECC Unbuffered DIMM

with SPD for 168pin (Intel/JEDEC)

77 : x72 /ECC PLL + Register DIMM

with SPD for 168pin (Intel PC100)

90 : x72 /ECC PLL + Register DIMM

with SPD for 168pin (JEDEC PC133)

4. Feature

S : SDRAM

5. Depth

16 : 16M

32 : 32M

64 : 64M

28 : 128M

56 : 256M

09 : 8M (for 128Mb/512Mb)

17 : 16M (for 128Mb/512Mb)

33 : 32M (for 128Mb/512Mb)

65 : 64M (for 128Mb/512Mb)

29 : 128M (for 128Mb/512Mb)

59 : 256M (for 128Mb/512Mb)

6. Refresh, # of Banks in comp. & Interface

2 : 4K/ 64ms Ref., 4Banks & LVTTL

5 : 8K/ 64ms Ref., 4Banks & LVTTL

7. Composition Component

0 : x4

3 : x8

4 : x16

8 : x 4 Stack (Flexframe)

9 : x 8 Stack (Flexframe)

8. Component Revision

M : 1st Gen.

B : 3rd Gen.

D : 5th Gen.

F : 7th Gen.

J : 11h Gen.

A : 2nd Gen.

C : 4th Gen.

E : 6th Gen.

H : 9h Gen.

9. Package

T : TSOP(II)

(400mil)

N : sTSOP(II) (400mil)

U : TSOP(II) Lead-free (400mil)

V : sTSOP(II) Lead-free (400mil)

10. PCB Revision & Type

0 : Mother PCB

2 : 2nd Rev.

U : Low Profile DIMM

1 : 1st Rev.

3 : 3rd Rev.

S : 4Layer PCB.

11. Power

C : Commercial Normal

L : Commercial Low

( 0°C ~ 70°C)

( 0°C ~ 70°C)

12. Speed (Default CL= 3 )

7A : PC133 (133MHz CL=3/PC100 CL2)

November 2007

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