IRF1104S/L
Electrical Characteristics @ TJ = 25ยฐC (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS Drain-to-Source Breakdown Voltage
40 โโโ โโโ V VGS = 0V, ID = 250ยตA
โV(BR)DSS/โTJ Breakdown Voltage Temp. Coefficient โโโ 0.038 โโโ V/ยฐC Reference to 25ยฐC, ID = 1mAย
RDS(on)
Static Drain-to-Source On-Resistance โโโ โโโ 0.009 โฆ VGS = 10V, ID = 60A ย
VGS(th)
Gate Threshold Voltage
2.0 โโโ 4.0 V VDS = VGS, ID = 250ยตA
gfs
Forward Transconductance
37 โโโ โโโ S VDS = 30V, ID = 60Aย
IDSS
Drain-to-Source Leakage Current
โโโ โโโ 25
โโโ โโโ 250
ยตA VDS = 40V, VGS = 0V
VDS = 32V, VGS = 0V, TJ = 150ยฐC
IGSS
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
โโโ โโโ 100 nA VGS = 20V
โโโ โโโ -100
VGS = -20V
Qg
Total Gate Charge
โโโ โโโ 93
ID = 60A
Qgs
Gate-to-Source Charge
โโโ โโโ 29 nC VDS = 32V
Qgd
Gate-to-Drain ("Miller") Charge
โโโ โโโ 30
VGS = 10V, See Fig. 6 and 13 ยย
td(on)
Turn-On Delay Time
โโโ 15 โโโ
VDD = 20V
tr
td(off)
Rise Time
Turn-Off Delay Time
โโโ 114 โโโ
โโโ 28 โโโ ns
ID = 60A
RG = 3.6โฆ
tf
Fall Time
โโโ 19 โโโ
RD = 0.33โฆ, See Fig. 10 ยย
LS
Internal Source Inductance
Between lead,
โโโ 7.5 โโโ nH and center of die contact
Ciss
Input Capacitance
โโโ 2900 โโโ
VGS = 0V
Coss
Output Capacitance
โโโ 1100 โโโ pF VDS = 25V
Crss
Reverse Transfer Capacitance
โโโ 250 โโโ
ฦ = 1.0MHz, See Fig. 5ย
Source-Drain Ratings and Characteristics
Parameter
Min. Typ. Max. Units
Conditions
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode) ย
VSD
Diode Forward Voltage
โโโ โโโ 100ย
A
โโโ โโโ 400
โโโ โโโ 1.3 V
MOSFET symbol
D
showing the
integral reverse
G
p-n junction diode.
S
TJ = 25ยฐC, IS =60A, VGS = 0V ย
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
โโโ 74 110 ns TJ = 25ยฐC, IF =60A
โโโ 188 280 nC di/dt = 100A/ยตs ยย
ton
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
ย Repetitive rating; pulse width limited by
ย Pulse width โค 300ยตs; duty cycle โค 2%.
max. junction temperature. ( See fig. 11 )
ย Starting TJ = 25ยฐC, L = 194ยตH
RG = 25โฆ, IAS = 60A. (See Figure 12)
ย
Uses IRF1104 data and test conditions.
ย Calculated continuous current based on maximum allowable
ย ISD โค 60A, di/dt โค 304A/ยตs, VDD โค V(BR)DSS,
TJ โค 175ยฐC
junction temperature;for recommended current-handling of the
package refer to Design Tip # 93-4
** When mounted on 1" square PCB ( FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
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