I5216 View Datasheet(PDF) - Winbond
Part Name
Description
Manufacturer
I5216 Datasheet PDF : 83 Pages
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I5216 SERIES
Advanced Information
PRELIMINARY
I5216 SERIES BONDING PHYSICAL LAYOUT (1) (UNPACKAGED DIE)
VSSD VSSD A0 SDA A1 SCL VCCD VCCD MCLK INT RAC SDIO SDI VSSA
I5216 Series
Die Dimensions
I5216 Series
X:D4ie3D8i0meµnmsions
Y: 988X0: µ43m80µm
Die ThicknDeiessT(hY3i):c9kn8e8s0(sµ3)m
29P2a.d1 2µ9m2.1O+µpm1e2n+i.n71g2µ.7mµm
Pad Opening (9m0ixn)90µm
3.5 x 3.5 mils
90x 90 µm
3.5 x 3.5 mils
I5216
VSSA MIC+ MIC - MICBS ACAP
SP-
VSSA(2) SP+ VCCA(2) AUXIN AUXOUT SCK WS
1.
The backside of die is internally connected to Vss. It MUST NOT be connected to any other
potential or damage may occur.
2.
Double bond recommended.
This figure reflects the current die thickness. Please contact Winbond as this thickness may change
in the future.
Publication Release Date: November 30, 2001
- 81
Revision A1
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