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I5216-X View Datasheet(PDF) - Winbond

Part Name
Description
Manufacturer
I5216-X Datasheet PDF : 83 Pages
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I5216 SERIES
Advanced Information
PRELIMINARY
POWER AND GROUND PINS
VCCA, VCCD (Voltage Inputs)
To minimize noise, the analog and digital circuits in the Winbond I5216 device use separate power
busses. These +3 V busses lead to separate pins. Tie the VCCD pins together as close as possible, and
decouple both supplies as near to the package as possible.
VSSA, VSSD (Ground Inputs)
The Winbond I5216 series utilizes separate analog and digital ground busses. The analog ground
(VSSA) pins should be tied together as close to the package as possible, and connected through a low-
impedance path to power supply ground. The digital ground (VSSD) pin should be connected through a
separate low impedance path to power supply ground. These ground paths should be large enough to
ensure that the impedance between the VSSA pins and the VSSD pin is less than 3. The backside of
the die is connected to VSSD through the substrate resistance. In a chip-on-board design, the die attach
area must be connected to VSSD.
NC (No Connect)
These pins should not be connected to the board at any time. Connection of these pins to any signal,
ground or VCC, may result in incorrect device behavior or cause damage to the device.
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Publication Release Date: November 30, 2001
Revision A1
 

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