HIN235CP View Datasheet(PDF) - Harris Semiconductor

Part Name

Description

Manufacturer

HIN235CP

+5V Powered RS-232 Transmitters/Receivers

Harris Semiconductor 

HIN230 thru HIN241

Die Characteristics

DIE DIMENSIONS:

160 mils x 140 mils

METALLIZATION:

Type: Al

Thickness: 10kÅ ±1kÅ

SUBSTRATE POTENTIAL

V+

Metallization Mask Layout

R2IN

T2OUT T1OUT

PASSIVATION:

Type: Nitride over Silox

Nitride Thickness: 8kÅ

Silox Thickness: 7kÅ

TRANSISTOR COUNT:

238

PROCESS:

CMOS Metal Gate

HIN240

T3OUT T4OUT R3IN

R3OUT T5IN

R2OUT

T2IN

T1IN

R1OUT

SHUTDOWN

EN

T5OUT

R4IN

R1IN

GND

VCC

C1+ V+

C1-

C2+

C2-

V-

8-41

R4OUT

T4IN

T3IN

R5OUT

R5IN

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