HCPL-0466-500E View Datasheet(PDF) - Avago Technologies
Part Name
Description
Manufacturer
HCPL-0466-500E Datasheet PDF : 21 Pages
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Solder Reflow Temperature Profile
300
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
PEAK
TEMP.
245 °C
200
160 °C
150 °C
140 °C
100
ROOM
TEMPERATURE
0
0
2.5 C ± 0.5 °C/SEC.
30
SEC.
30
3 °C + 1 °C/–0.5 °C
SEC.
PREHEATING TIME
150 °C, 90 + 30 SEC.
50
100
150
TIME (SECONDS)
PEAK
TEMP.
240 °C
SOLDERING
TIME
200 °C
PEAK
TEMP.
230 °C
50 SEC.
200
TIGHT
TYPICAL
LOOSE
250
NOTE: NON-HALIDE FLUX SHOULD BE USED.
Recommended Pb-Free IR Profile
tp
Tp
TL 217 °C
* 260 +0/-5 °C
RAMP-UP
3 °C/SEC. MAX.
Tsmax
150 - 200 °C
Tsmin
ts
PREHEAT
tL
60 to 180 SEC.
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
60 to 150 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
Tsmax = 200 °C, Tsmin = 150 °C
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 400mils PACKAGE IS 245 °C
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