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H1117 查看數據表(PDF) - Hi-Sincerity Mocroelectronics

零件编号产品描述 (功能)生产厂家
H1117 1.2A Low Dropout Positive Voltage Regulator HSMC
Hi-Sincerity Mocroelectronics HSMC
H1117 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : IC200401
Issued Date : 2004.02.01
Revised Date : 2005.07.14
Page No. : 6/8
TO-252 Dimension
M
Marking:
DIM Min. Max.
A
6.35 6.80
A
a1
Pb Free Mark
C
4.80 5.50
Pb-Free: " . " (Note)
Normal: None H
J
F
1.30 1.70
F
1117
Product Series
G
5.40 6.25
ADJ(A),1.8(B),2.5(C)
3.3(D),5(E)
H
2.20 3.00
C
Date Code
Control Code
L
0.40 0.90
M
2.20 2.40
G
Note: Green label is used for pb-free packing
N
0.90 1.50
a1 0.40 0.65
Pin Style: 1.ADJ/GND 2.VOUT 3.VIN
a2
-
*2.30
1
2
3
N
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
a5 0.65 1.05
*: Typical, Unit: mm
a5
H
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
L
a2
a1
3-Lead TO-252 Plastic
Surface Mount Package
HSMC Package Code: J
A
B
C
D
a1
E
J
K
a2
y2
F
y1
M
a1
Marking:
Pb Free Mark
Pb-Free: " . " (Note)
Normal: None H
J
1117
Product Series
ADJ(A),1.8(B),2.5(C)
3.3(D),5(E)
Date Code
Control Code
GI
y1
H
L
a2
y1
N
a1
O
Note: Green label is used for pb-free packing
Pin Style: 1.ADJ/GND 2.VOUT 3.VIN
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
y2
3-Lead TO-252 Plastic
Surface Mount Package
HSMC Package Code: J
DIM Min. Max.
A
6.40 6.80
B
-
6.00
C
5.04 5.64
D
-
*4.34
E
0.40 0.80
F
0.50 0.90
G
5.90 6.30
H
2.50 2.90
I
9.20 9.80
J
0.60 1.00
K
-
0.96
L
0.66 0.86
M
2.20 2.40
N
0.70 1.10
O
0.82 1.22
a1 0.40 0.60
a2 2.10 2.50
y1
-
5o
y2
-
3o
*: Typical, Unit: mm
H1117 Series
HSMC Product Specification
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