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E28F004BX-B60 View Datasheet(PDF) - Intel

Part Name
Description
Manufacturer
E28F004BX-B60 Datasheet PDF : 50 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
28F400BX-T B 28F004BX-T B
1 6 28F004BX Pin Descriptions
Symbol Type
Name and Function
A0 – A18
I ADDRESS INPUTS for memory addresses Addresses are internally latched during
a write cycle
A9
I
ADDRESS INPUT When A9 is at 12V the signature mode is accessed During this
mode A0 decodes between the manufacturer and device ID’s
DQ0 – DQ7 I O DATA INPUTS OUTPUTS Inputs array data on the second CE and WE cycle
during a program command Inputs commands to the command user interface when
CE and WE are active Data is internally latched during the write and program
cycles Outputs array Intelligent Identifier and status register data The data pins
float to tri-state when the chip is deselected or the outputs are disabled
CE
I CHIP ENABLE Activates the device’s control logic input buffers decoders and
sense amplifiers CE is active low CE high deselects the memory device and
reduces power consumption to standby levels If CE and RP are high but not at
a CMOS high level the standby current will increase due to current flow through the
CE and RP input stages
RP
I RESET DEEP POWERDOWN Provides Three-State control Puts the device in
deep power-down mode Locks the Boot Block from program erase
When RP is at logic high level and equals 6 5V maximum the Boot Block is locked
and cannot be programmed or erased
When RP e 11 4V minimum the Boot Block is unlocked and can be programmed
or erased
When RP is at a logic low level the Boot Block is locked the deep power-down
mode is enabled and the WSM is reset preventing any blocks from being
programmed or erased therefore providing data protection during power transitions
When RP transitions from logic low to logic high the flash memory enters the
read-array mode
OE
I OUTPUT ENABLE Gates the device’s outputs through the data buffers during a
read cycle OE is active low
WE
I WRITE ENABLE Controls writes to the Command Register and array blocks WE
is active low Addresses and data are latched on the rising edge of the WE pulse
VPP
VCC
GND
PROGRAM ERASE POWER SUPPLY For erasing memory array blocks or
programming data in each block
NOTE VPP k VPPLMAX memory contents cannot be altered
DEVICE POWER SUPPLY (5V g10% 5V g5%)
GROUND For all internal circuitry
NC
NO CONNECT Pin may be driven or left floating
DU
DON’T USE PIN Pin should not be connected to anything
10
 

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