FQP30N06 View Datasheet(PDF) - Fairchild Semiconductor
Part Name
Description
Manufacturer
FQP30N06 Datasheet PDF : 9 Pages
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Typical Characteristics (Continued)
1.2
1.1
1.0
0.9
※Notes :
1.
2.
VIDG=S =2500Vμ
A
0.8
-100
-50
0
50
100
150
200
TJ, Junction Temperature [oC]
Figure 7. Breakdown Voltage Variation
vs. Temperature
103
Operation in This Area
is Limited by RDS(on)
102
100 μs
1 ms
10 ms
101
DC
100
※ Notes :
1. TC = 25 oC
2. TJ = 175 oC
3. Single Pulse
10-1
10-1
100
101
102
VDS, Drain-Source Voltage [V]
Figure 9. Maximum Safe Operating Area
2.5
2.0
1.5
1.0
0.5
※ Notes :
1.
2.
IVDG=S
= 10 V
15 A
0.0
-100
-50
0
50
100
150
200
TJ, Junction Temperature [oC]
Figure 8. On-Resistance Variation
vs. Temperature
35
30
25
20
15
10
5
0
25
50
75
100
125
150
175
TC, Case Temperature [℃]
Figure 10. Maximum Drain Current
vs. Case Temperature
1 0 0 D =0 .5
1 0 -1
0 .2
0 .1
0 .05
0 .0 2
0 .0 1
sing le p u lse
※ Notes :
1 . Z θ J C( t ) = 1 . 9 0 ℃ /W M a x .
2 . D u t y Fa c t o r , D =t 1/t 2
3 . T J M - T C = P D M * Z θ J C( t )
PDM
t1
t2
1 0 -2
1 0 -5
1 0 -4
1 0 -3
1 0 -2
1 0 -1
100
101
t1, S q u a re W a v e P u ls e D u ra tio n [s e c ]
Figure 11. Transient Thermal Response Curve
©2000 Fairchild Semiconductor Corporation
4
FQP30N06 Rev. C1
www.fairchildsemi.com
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