The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
FH12 Seriesq0.5mm and 1mm Pitch Connectors For FPC/FFC
sRecommended Temperature Profile
MAX 250ç
250
230ç
200
200ç
150
(ç)
100
150ç
50
25ç
(60 seconds) 90 to 120 seconds
30 seconds
0
Start
60 Preheating 120 Soldering
Time
HRS test conditions
Solder method
:Reflow, IR/hot air
Environment:
:Room air
Solder composition :Paste, 96.5%Sn/3%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.’s
Part Number: M705-221CM5-32-10.5)
Test board
:Glass epoxy 40mm∞80mm∞1.6mm thick
Land dimensions :Top and bottom
contact type 0.3mm∞1.3mm
Vertical mounting type 0.6mm∞1.5mm
Metal mask
:Top and bottom contact type
0.25mm∞1.3mm∞0.15mm thick
Vertical mounting type
0.5mm∞1.5mm∞0.15mm thick
This temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
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