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FDC37B773 View Datasheet(PDF) - SMSC -> Microchip

Part NameDescriptionManufacturer
FDC37B773 Enhanced Super I/O Controller with Wake-Up Features and Consumer IR SMSC
SMSC -> Microchip SMSC
FDC37B773 Datasheet PDF : 196 Pages
First Prev 191 192 193 194 195 196
D
D1
E
E1
e
W
A
A2
H
0.10
-C-
A1
DIM
A
A1
A2
D
D1
E
E1
H
L
L1
e
0
W
TD(1)
TE(1)
TD(2)
TE(2)
MIN
MAX
2.80
3.15
0.1
0.45
2.57
2.87
23.4
24.15
19.9
20.1
17.4
18.15
13.9
14.1
0.1
0.65
0.2
0.95
1.8
2.6
0.65 BSC
12°
.2
.4
21.8
22.2
15.8
16.2
22.21
22.76
16.27
16.82
TD/TE
MIN
MAX
.110
.124
.004
.018
.101
.113
.921
.951
.783
.791
.685
.715
.547
.555
.004
.026
.008
.037
.071
.102
.0256 BSC
12°
.008
.016
.858
.874
.622
.638
.874
.896
.641
.662
0
L
L1
Notes:
1) Coplanarity is 0.100mm (.004") maximum.
2) Tolerance on the position of the leads is
0.200mm (.008") maximum.
3) Package body dimensions D1 and E1 do not
include the mold protrusion. Maximum mold
protrusion is 0.25mm (.010").
4) Dimensions TD and TE are important for testing
by robotic handler. Only above combinations of (1)
or (2) are acceptable.
5) Controlling dimension: millimeter. Dimensions
in inches for reference only and not necessarily
accurate.
FIGURE 23 - 100 PIN QFP PACKAGE OUTLINE
194
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