FAN1540MMPX View Datasheet(PDF) - Fairchild Semiconductor

Part Name

Description

Manufacturer

FAN1540MMPX

1A/1.3A, LDO with Low Quiescent Current

Fairchild Semiconductor 

Absolute Maximum Ratings

Operating Input Voltage

Power Dissipation

Parameter

Short Circuit Output Current

Operating Junction Temperature Range

Thermal Resistance–Junction to Tab, TO-252

Thermal Resistance–Junction to Tab, 3mmx3mm 6-lead MLP (Note 3)

Thermal Resistance–Junction to Tab, 5mmx6mm 8-lead MLP (Note 3)

Storage Temperature Range (Note 3)

Lead Temperature (I.R. Reflow) 30 Sec. (Note 4)

Lead Temperature (Soldering) 10 Sec. (Note 4)

Electrostatic Discharge Protection (Note 5)

HBM

CDM

Symbol

VIN

PD

IOSH

TJ

θJC

θJC

θJC

TSTG

TLEAD

TLEAD

ESD

Value

10

Internally

Limited

Internally

Limited

0 to 150

3

8

4

-65 to 150

240

260

4

2

Units

V

W

A

°C

°C/W

°C/W

°C/W

°C

°C

°C

kV

Notes:

3. Junction to ambient thermal resistance, θJA, is a strong function of PCB material, board thickness, thickness and

number of copper plains, number of via used, diameter of via used, available copper surface, and attached heat sink

characteristics.Thermal resistance (θJA), VIN, IOUT must be chosen not to exceed TJ = 150°C.

4. Soldering temperature should be 260°C for 10 second after 240°C for 30 second in I.R. reflow using 60/40 solder.

Maximum rate of temperature rise is 3°C/SEC to within 100°C of the final temperature.

5. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).

3

FAN1539/FAN1540 Rev. 1.1.1

www.fairchildsemi.com

Share Link: