CREAT BY ART
Pb
RoHS
COMPLIANCE
Features
For surface mounted application
Low profile package
Low power loss, high efficiency
Ideal for automated placement
Glass passivated chip junction
High temperature soldering:
260℃/10 seconds at terminals
Green compound with suffix "G" on packing
code & prefix "G" on datecode
ES1AL - ES1JL
1.0AMP. Surface Mount Super Fast Rectifiers
Sub SMA
Mechanical Data
Case: Sub SMA plastic case
Terminal: Pure tin plated, lead free
Polarity: Color band cathode end
Packing: 8mm/12mm tape per EIA STD RS-481
Weight: 0.0196 grams
Dimensions in inches and (millimeters)
Marking Diagram
EXL
= Specific Device Code
G
= Green Compound
Y
= Year
M
= Work Month
Maximum Ratings and Electrical Characteristics
Rating at 25 ℃ ambient temperature unless otherwise specified.
Single phase, half wave, 60 Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Type Number
Symbol
ES
1AL
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
Peak Forward Surge Current, 8.3 ms Single Half Sine-
wave Superimposed on Rated Load (JEDEC method)
VRRM
50
VRMS
35
VDC
50
IF(AV)
IFSM
Maximum Instantaneous Forward Voltage (Note 1)
@1A
VF
Maximum Reverse Current @ Rated VR TA=25 ℃
T A=125 ℃
IR
Maximum Reverse Recovery Time (Note 2)
Trr
Typical Junction Capacitance (Note 3)
Cj
Typical Thermal Resistance
RθjA
RθjL
Operating Temperature Range
TJ
Storage Temperature Range
TSTG
Note 1: Pulse Test with PW=300 usec, 1% Duty Cycle
Note 2: Reverse Recovery Test Conditions: I F=0.5A, IR=1.0A, IRR=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
ES ES
1BL 1CL
100 150
70 105
100 150
0.95
10
ES ES ES ES ES
1DL 1FL 1GL 1HL 1JL
200 300 400 500 600
140 210 280 350 420
200 300 400 500 600
1
30
1.3
5
100
35
85
35
- 55 to + 150
- 55 to + 150
1.7
8
Unit
V
V
V
A
A
V
uA
nS
pF
OC/W
OC
OC
Version:F11