DF37 View Datasheet(PDF) - HIROSE ELECTRIC

Part Name

Description

Manufacturer

DF37

0.4 mm Pitch, 0.98 mm Mated Height, Board-to-Board / Board-to-FPC Connectors

HIROSE ELECTRIC 

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

DF37 Seriesq0.4 mm Pitch, 0.98 mm Mated Height, Board-to-Board / Board-to-FPC Connectors

BUsage Recommendations

1.Recommended temperature profile

Temperature (ç)

250

200

150 150ç

100

250ç

220ç

180ç

60sec max

90~120sec

50

Room temperature

0

50

100

150

200

250

300

Time (sec.)

Note 1: Up to 2 cycles of Reflow soldering are possible under the

same conditions, provided that there is a return to normal

temperature between the first and second cycle.

Note 2: The temperature profile indicates the board surface

temperature at the point of contacts with the connector

terminals.

2.Recommended manual soldering

3.Recommended screen thickness and open

area ratio (Pattern area ratio)

4.Board warpage

5.Cleaning conditions

6.Precautions

Manual soldering: 340±10ç for 3 seconds

Thickness: 0.12 mm

Open area ratio: Receptacle:80%, Plug: 70%

Maximum of 0.02 mm at the connector center, with both ends of the

connector as reference points.

Cleaning is not recommended. When cleaning, please evaluate as it

can deteriorate the performance including mechanical operation and

environmental resistance.

s Mating and un-mating of the connectors when not soldered on the

boards is not recommended as this may cause deformation of the

terminals, damage to the contacts or insulators.

s Mated connectors should not carry weight of the board by

themselves. Provide some other support of the boards.

s When mating/un-mating do not twist or lift by the corners. Apply the

forces evenly across the entire length and width of the connectors

taking care NOT to damage or deform soldered terminations.

s Exercise extreme caution when mating/ un-mating when the

connector is mounted on a nonrigid (flexible) substrate.

Slight discoloration on the insulating materials will not affect form,

fit or function of the connectors.

s Do NOT pull on the flexible substrate.

118

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