IR reflow condition
Preheating area 150ç for 100 to 120 seconds
Soldering area 235ç5ç for 10 seconds max.
220ç min for 10 to 30 seconds
Note 1. Maximum twice action is allowed under the same condition. However, the interval between
the first and second actions must be maintained at the room temperature.
Note 2.The temperature indicates the board surface temperature of the connector lead area.
2. Recommended Manual
Soldering iron temperature: 290±10çoldering time: Within 2 seconds
4. Board Warp(SMT)
Max 0.2mm in the connector center area, based on the both connector edges
5. Cleaning Condition
Refer to the "Nylon Connector Use Hand book".
s The header is designed in a structure where contacts are exposed. Touching it with bare
hands would cause contact failure or electrostatic element damage.
s Where no board is mounted, the insertion or extraction will cause damage or contact deformation.
s Avoid retaining the board with the connector only, and fix the board by any other means than the connector.
s Excessive scoop insertion or extraction may result in damage.
s In the manual soldering process, don't carry out the flux coating which will cause a flux blister on the connector.
s The color phase of this product may be slightly different from that of the formed product
according to the manufacturing lot. However, the difference doesn't affect the performance.