SLAS352C − DECEMBER 2001 − REVISED AUGUST 2004
D 400-MSPS Update Rate
D LVDS-Compatible Input Interface
D Spurious Free Dynamic Range (SFDR) to
− 69 dBc at 70-MHz IF, 400 MSPS
D W-CDMA Adjacent Channel Power Ratio
− 73 dBc at 30.72-MHz IF, 122.88 MSPS
− 71 dBc at 61.44-MHz IF, 245.76 MSPS
D Differential Scalable Current Outputs: 2 mA to
D On-Chip 1.2-V Reference
D Single 3.3-V Supply Operation
D Power Dissipation: 820 at fclk = 400 MSPS,
fout = 70 MHz
D Package: 48-Pin HTQFP PowerPad,
TJA = 28.8°C/W
D Cellular Base Transceiver Station Transmit
− CDMA: WCDMA, CDMA2000, IS−95
− TDMA: GSM, IS−136, EDGE/GPRS
− Supports Single-Carrier and Multicarrier
D Test and Measurement: Arbitrary Waveform
D Direct Digital Synthesis (DDS)
D Cable Modem Headend
The DAC5675 is a 14-bit resolution high-speed
digital-to-analog converter. The DAC5675 is designed
for high-speed digital data transmission in wired and
wireless communication systems, high-frequency
direct-digital synthesis (DDS), and waveform
reconstruction in test and measurement applications.
The DAC5675 has excellent spurious free dynamic
range (SFDR) at high intermediate frequencies, which
makes the DAC5675 well suited for multicarrier
transmission in TDMA and CDMA based cellular base
transceiver stations BTS.
The DAC5675 operates from a single-supply voltage of
3.3 V. Power dissipation is 820 mW at fclk = 400 MSPS,
fout = 70 MHz. The DAC5675 provides a nominal
full-scale differential current output of 20 mA,
supporting both single-ended and differential
applications. The output current can be directly fed to
the load with no additional external output buffer
required. The output is referred to the analog supply
The DAC5675 is manufactured on Texas Instruments
advanced high-speed mixed-signal BiCMOS process.
The DAC5675 comprises a LVDS (low-voltage
differential signaling) interface. LVDS features a low
differential voltage swing with a low constant power
consumption across frequency, allowing for high speed
data transmission with low noise levels, i.e., low
electromagnetic interference (EMI). LVDS is typically
implemented in low-voltage digital CMOS processes,
making it the ideal technology for high-speed interfacing
between the DAC5675 and high-speed low-voltage
CMOS ASICs or FPGAs. The DAC5675 current-
source-array architecture supports update rates of up to
400 MSPS. On-chip edge-triggered input latches
provide for minimum setup and hold times thereby
relaxing interface timing.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 2002 − 2004, Texas Instruments Incorporated