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CXA1600P View Datasheet(PDF) - Sony Semiconductor

Part Name
Description
Manufacturer
CXA1600P Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Package Outline Unit : mm
CXA1600M
8PIN SOP (PLASTIC)
+ 0.4
5.0 – 0.1
8
5
A
+ 0.4
1.25 – 0.15
0.10
CXA1600M/P
1
4
1.27
b
0.24 M
B
+ 0.15
0.1 – 0.1
+ 0.1
b = 0.4 – 0.05
(0.4)
b = 0.4 ± 0.03
0° to 10°
DETAILA
DETAIL B : SOLDER
DETAIL B : PALLADIUM
PACKAGE STRUCTURE
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-8P-L03
SOP008-P-0225
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER/PALLADIUM
PLATING
42/COPPER ALLOY
0.1g
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
CXA1600P
8PIN DIP (PLASTIC)
+ 0.4
9.4 – 0.1
8
5
1
4
2.54
0° to 15°
0.5 ± 0.1
1.2 ± 0.15
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-8P-01
DIP008-P-0300
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
EPOXY RESIN
SOLDER PLATING
LEAD MATERIAL
PACKAGE MASS
COPPER ALLOY
0.5g
—9—
 

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