CUS03(2018) View Datasheet(PDF) - Toshiba
Part Name
Description
Manufacturer
CUS03 Datasheet PDF : 5 Pages
| |||
IF – VF
10
Tj = 150°C
1
100°C
0.1
75°C
25°C
0.01
0
Pulse test
0.2
0.4
0.6
0.8
1.0
1.2
Forward voltage VF (V)
CUS03
PF (AV) – IF (AV)
0.5
DC
0.4
180°
120°
0.3
α = 60°
0.2
Rectangular
waveform
0.1
0° α 360°
Conduction
angle: α
0
0
0.2
0.4
0.6
0.8
1.0
1.2
Average forward current IF (AV) (A)
Ta max – IF (AV)
160
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
140
Soldering land size: 2 mm × 2 mm
board thickness: 0.64 mm
120
100
80
α = 60° 120°
180°
DC
60
Rectangular
waveform
40
0° α 360°
20 Conduction
angle: α
0
VR = 20 V
0
0.2
0.4
0.6
0.8
1.0
1.2
Average forward current IF (AV) (A)
Ta max – IF (AV)
160
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
140
Soldering land size: 6 mm × 6 mm
board thickness: 1.6 mm
120
100
80
α = 60°
60 Rectangular
waveform
40
0° α 360°
20 Conduction
angle: α
0 VR = 20 V
0
0.2
120°
0.4
0.6
180°
0.8
DC
1.0
1.2
Average forward current IF (AV) (A)
Tℓ max – IF (AV)
160
140
120
100
80
α = 60° 120°
180°
DC
Rectangular
60 waveform
40
0° α 360°
20 Conduction
angle: α
0
VR = 20 V
0
0.2
0.4
0.6
0.8
1.0
1.2
Average forward current IF (AV) (A)
1000
100
rth (j-a) – t
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land size : 6 mm × 6 mm
board thickness: 1.6 mm
Device mounted on a ceramic board:
10
board size : 50 mm × 50 mm
Soldering land size: 2 mm × 2 mm
board thickness: 0.64 mm
1
0.001
0.01
0.1
1
10
Time t (s)
100
1000
3
2018-07-02
|
|
Share Link: 