TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CUS01
CUS01
Portable Equipment Battery Applications
• Repetitive peak reverse voltage : VRRM = 30 V
• Average forward current
: IF (AV) = 1.0 A
• Peak forward voltage
: VFM = 0.37 V (max) @IF = 0.7 A
• Suitable for high-density board assembly due to the use of a small
Toshiba Nickname: US−FLATTM
1.25
+ 0.2
− 0.1
0.88 ± 0.1
②
Unit: mm
0.13
+
−
0.05
0.03
Absolute Maximum Ratings (Ta = 25°C)
①
Characteristics
Repetitive peak reverse voltage
Symbol
Rating
Unit
VRRM
30
V
0.6 ± 0.1
0.88 ± 0.1
Average forward current
IF (AV) 1.0 (Note 1)
A
0.6 ± 0.1
Non-repetitive peak forward surge current
IFSM
20 (50 Hz)
A
Junction temperature
Tj
−40 to 125
°C
Storage temperature range
Tstg
−40 to 150
°C
Note 1: Tℓ = 86°C: Rectangular waveform (α = 180°), VR = 15 V
① ANODE
② CATHODE
0.78 ± 0.1
Note 2: Using continuously under heavy loads (e.g. the application of
0.6 ± 0.1
high temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
JEDEC
―
reliability significantly even if the operating conditions (i.e.
JEITA
―
operating temperature/current/voltage, etc.) are within the
absolute maximum ratings.
TOSHIBA
3-2B1S
Please design the appropriate reliability upon reviewing the
Toshiba Semiconductor Reliability Handbook (“Handling
Weight: 0.004 g (typ.)
Precautions”/“Derating Concept and Methods”) and individual
reliability data (i.e. reliability test report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Junction capacitance
Thermal resistance
(junction to ambient)
Thermal resistance (junction to lead)
Symbol
Test Condition
Min
VFM (1) IFM = 0.1 A (pulse test)
―
VFM (2) IFM = 0.7 A (pulse test)
―
VFM (3) IFM = 1.0 A (pulse test)
―
IRRM (1) VRRM = 5 V (pulse test)
―
IRRM (2) VRRM = 30 V (pulse test)
―
Cj
VR = 10 V, f = 1.0 MHz
―
Device mounted on a ceramic board
board size
50 mm × 50 mm
soldering land size 2 mm × 2 mm
―
Rth (j-a)
board thickness
0.64 mm
Device mounted on a glass-epoxy board
board size
50 mm × 50 mm
soldering land size 6 mm × 6 mm
―
board thickness
1.6 mm
Rth (j-ℓ ) Junction to lead of cathode side
―
Typ. Max Unit
0.25 ―
0.33 0.37
V
0.39 ―
50
―
μA
0.5 1.5 mA
40
―
pF
―
75
°C/W
―
150
―
30 °C/W
Start of commercial production
2001-12
1
2018-07-11