CUS01(2008) View Datasheet(PDF) - Toshiba
Part Name
Description
Manufacturer
CUS01 Datasheet PDF : 4 Pages
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TOSHIBA Rectifier Silicon Diffused Type
CRG04
General-Purpose Rectifier Applications
• Repetitive peak reverse voltage: VRRM = 600 V
②
• Average forward current: IF (AV) = 1.0 A
• Average forward voltage: VFM = 1.1V(Max)
• Suitable for high-density board assembly due to the use of a small
surface-mount package, S−FLATTM
CRG04
Unit: mm
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
0.9 ± 0.1
0.16
+ 0.2
①
1.6 − 0.1
Repetitive Peak Reverse Voltage
VRRM
600
V
Average Forward Current
IF (AV)
1.0(Note1)
A
Peak One Cycle Surge Forward
Current (Non−Repetitive)
IFSM
15.0 (50Hz)
A
Junction Temperature
Tj
−40 to 150
°C
Storage Temperature Range
Tstg
−40 to 150
°C
Note 1: Ta=66°C
Device mounted on a ceramic board
board size: 50 mm × 50 mm
soldering land: 2 mm ×2 mm
board thickness: 0.64 mm
Half-sine waveform: α =180°
① ANODE
② CATHODE
JEDEC
―
JEITA
―
TOSHIBA
3-2A1A
Weight: 0.013 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Thermal resistance
Symbol
VFM(1)
VFM(2)
VFM(3)
IRRM
Rth (j-a)
Rth (j-ℓ)
Test Condition
IFM = 0.1 A (Pulse test)
IFM = 0.7 A (Pulse test)
IFM = 1.0 A (Pulse test)
VRRM = 600 V (Pulse test)
Device mounted on a ceramic board
Board size: 50 mm × 50 mm
Soldering land: 2 mm × 2 mm
Board thickness: 0.64 mm
Device mounted on a glass-epoxy board
Board size: 50 mm × 50 mm
Soldering land: 6 mm × 6 mm
Board thickness: 1.6 mm
―
Min Typ. Max Unit
⎯ 0.84 ⎯
V
⎯ 0.95 ⎯
V
⎯ 0.98 1.1
V
⎯
⎯
10
μA
⎯
⎯
65
°C/W
⎯
⎯
130
⎯
⎯
20 °C/W
1
2008-02-01
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