CRCW0402-HPE3 View Datasheet(PDF) -

CRCW-HP e3

Pulse Proof, High Power Thick Film Chip Resistors

Vishay

TEST PROCEDURES AND REQUIREMENTS

EN

60115-1

CLAUSE

IEC

60068-2

TEST

METHOD

TEST

PROCEDURE

REQUIREMENTS PERMISSIBLE

CHANGE (ΔR)

STABILITY CLASS 2 OR BETTER

Stability for product types:

CRCW-HP e3

1 Ω to 1 MΩ

4.5

-

4.7

-

4.13

-

4.17.2 58 (Td)

Resistance

Voltage proof

Short time overload

Solderability

-

U = 1.4 x Uins; 60 s

≤

2

×

U

Umax.;

= 2.5 x

Duration

P70 x R

according

to

style

Solder bath method; Sn60Pb40;

non-activated flux; (235 ± 5) °C; (2 ± 0.2) s

Solder bath method; Sn96.5Ag3Cu0.5;

non-activated flux; (245 ± 5) °C; (3 ± 0.3) s

± 1 %, ± 5 %

-

± (0.5 % R + 0.05 Ω)

Good tinning (≥ 95 % covered)

no visible damage

Good tinning (≥ 95 % covered)

no visible damage

4.8.4.2

4.32

-

21 (UU3)

4.33

21 (UU1)

Temperature coefficient

Shear (adhesion)

Substrate bending

4.19

14 (Na)

Rapid change of temperature

4.23

-

Dry heat

(20/- 55/20) °C and (20/125/20) °C

45 N

Depth 2 mm; 3 times

30 min. at - 55 °C; 30 min at 125 °C

5 cycles

1000 cycles

-

± 100 ppm/K, ± 200 ppm/K

No visible damage

No visible damage,

no open circuit in bent position

± (0.25 % R + 0.05 Ω)

± (0.5 % R + 0.05 Ω)

± (1 % R + 0.05 Ω)

4.23.2

4.23.3

4.23.4

2 (Ba)

30 (Db)

1 (Aa)

Damp heat, cyclic

cold

Low air pressure

125 °C; 16 h

55 °C; ≥ 90 % RH; 24 h; 1 cycle

- 55 °C; 2 h

± (2 % R + 0.1 Ω)

4.23.5

4.23.6

4.23.7

4.25.1

4.18.2

4.35

4.24

4.25.3

13 (M)

30 (Db)

-

-

58 (Td)

-

78 (Cab)

-

-

Damp heat, cyclic

D.C. load

Endurance at 70 °C

Resistance to soldering heat

Flammability, needle flame test

Damp heat, steady state

Endurance at

upper category temperature

1 kPa; (25 ± 10) °C; 1 h

55 °C; ≥ 90 % RH; 24 h; 5 cycle

U = P70 x R

U = P70 x R ≤ Umax.

1.5 h on; 0.5 h off;

70 °C; 1000 h

70 °C; 8000 h

Solder bath method; (260 ± 5) °C; (10 ± 1) s

IEC 60695-15-5; 10 s

(40 ± 2) °C; (93 ± 3) % RH; 56 days

155 °C; 1000 h

± (2 % R + 0.1 Ω)

± (4 % R + 0.1 Ω)

± (0.5 % R + 0.05 Ω)

No burning after 30 s

± (1 % R + 0.05 Ω)

± (2 % R + 0.1 Ω)

4.40

-

Electrostatic discharge

(human body model)

IEC 61340-3-1; 3 positive and 3 negative

discharges; ESD voltage according to size

± (1 % R + 0.05 Ω)

4.29

45 (XA) Component solvent resistance

Isopropyl alcohol; 50 °C; method 2

No visible damage

4.30

4.22

4.37

4.27

45 (XA)

Solvent resistance of marking

6 (Fc) Vibration, endurance by sweeping

-

Periodic electric overload

-

Single pulse high voltage overload,

10 µs/700 µs

Isopropyl alcohol; 50 °C; method 1;

toothbrush

f = 10 Hz to 2000 Hz; x, y, z ≤ 1.5 mm;

A ≤ 200 m/s2; 10 sweeps per axis

U = 15 x P70 x R ≤ 2 x Umax.

0.1 s on; 2.5 s off; 1000 cycles

Û = 10 x P70 x R ≤ 2 x Umax.

10 pulses

Marking legible,

no visible damage

± (0.5 % R + 0.05 Ω)

± (1 % R + 0.05 Ω)

± (1 % R + 0.05 Ω)

All tests are carried out in accordance with the following specifications:

• EN 60115-1, generic specification

• EN 140400, sectional specification

• EN 140401-802, detail specification

• IEC 60068-2 environmental test procedures

Packaging of components is done in paper or blister tapes according to IEC 60286-3

Document Number: 20043

Revision: 26-Mar-10

For technical questions, contact: thickfilmchip@vishay.com

www.vishay.com

175

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