DatasheetQ Logo
Electronic component search and free download site.
Transistors,MosFET ,Diode,Integrated circuits

CMS11 View Datasheet(PDF) - Toshiba

Part Name
Description
Manufacturer
CMS11 Datasheet PDF : 5 Pages
1 2 3 4 5
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CMS11
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
CMS11
Unit: mm
Forward voltage: VFM = 0.55 V (max)
Average forward current: IF (AV) = 2.0 A
Repetitive peak reverse voltage: VRRM = 40 V
Suitable for compact assembly due to small surface-mount package
“MFLATTM” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
Repetitive peak reverse voltage
Average forward current
VRRM
40
V
IF (AV)
2.0
(Note 1) (Ta = 34°C)
A
IF (AV)
2.0
(T= 119°C)
Peak one cycle surge forward current
(non-repetitive)
IFSM
30 (50 Hz)
A
Junction temperature
Storage temperature
Tj
40~150
°C
Tstg
40~150
°C
JEDEC
JEITA
TOSHIBA
3-4E1A
Note 1: Device mounted on a ceramic board
(board size: 50 mm × 50 mm, soldering land: 2 mm × 2 mm)
Weight: 0.023 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Junction capacitance
Thermal resistance
Symbol
VFM (1)
VFM (2)
VFM (3)
IRRM
Cj
Rth (j-a)
Rth (j-)
Test Condition
Min
IFM = 0.5 A
IFM = 1.0 A
IFM = 2.0 A
VRRM = 5.0 V
VRRM = 40 V
VR = 10 V, f = 1.0 MHz
Device mounted on a ceramic board
(soldering land: 2 mm × 2 mm)
Device mounted on a glass-epoxy
board
(soldering land: 6 mm × 6 mm)
Typ. Max Unit
0.38
0.42
V
0.49 0.55
2.0
μA
20.0 500
95
pF
60
135 °C/W
16
1
2006-11-13
 

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]