CMP04FP View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

CMP04FP

Quad Low Power,Precision Comparator

Analog Devices 

CMP04

OUTLINE DIMENSIONS

14-Lead Standard Small Outline Package [SOIC]

Narrow Body

(R-14)

Dimensions shown in millimeters and (inches)

8.75 (0.3445)

8.55 (0.3366)

4.00 (0.1575) 14

3.80 (0.1496) 1

8 6.20 (0.2441)

7 5.80 (0.2283)

0.25 (0.0098)

0.10 (0.0039)

1.27 (0.0500)

BSC

1.75 (0.0689)

1.35 (0.0531)

0.50

0.25

((00..00109978))؋

45؇

COPLANARITY

0.10

0.51 (0.0201) SEATING

0.33 (0.0130) PLANE

8؇

0.25 (0.0098) 0؇ 1.27 (0.0500)

0.19 (0.0075) 0.40 (0.0157)

COMPLIANT TO JEDEC STANDARDS MS-012AB

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN

Revision History

Location

Page

3/03—Data Sheet changed from REV. C to REV. D.

Renumbered TPCs and Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Global

Deletion of 14-Lead CERDIP and 14-Lead PDIP information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Global

Changes to FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Changes to PIN CONNECTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Changes to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Changes to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Changes to ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Removal of DICE CHARACTERISTICS, WAFER TEST LIMITS, and TYPICAL ELECTRICAL

CHARACTERISTICS sections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Changes to TPCs 2, 5, and 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

–8–

REV. D

Share Link: