CHA5051 View Datasheet(PDF) - United Monolithic Semiconductors
Part Name
Description
Manufacturer
CHA5051 Datasheet PDF : 14 Pages
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7-16GHz Medium Power Amplifier
Chip Assembly and Mechanical Data
CHA5051
Note : 25µm diameter gold wire is to be prefered.
DC Pad size : 100/100µm .
RF wire bondings should be as short as possible, lower than 0.35mm.
Chip thickness : 100µm.
To Vd DC Drain supply
10nF
120pF
10nF
120pF
To Vg DC Gate supply
Ref: : DSCHA50517152 - 01 Jun 07
13/14
Specifications subject to change without notice
Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
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