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CD40175BMS View Datasheet(PDF) - Intersil

Part Name
Description
Manufacturer
CD40175BMS Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
CD40175BMS
Electrical Performance Characteristics (Continued)
105 8
6
AMBIENT TEMPERATURE (TA) = +25oC
4
2
104 8
SUPPLY VOLTAGE (VDD) = 15V
6
4
5V
2
103 8
6
10V
4
2
102 8
6
4
2
CL = 50pF
CL = 15pF
10
1
2 4 68 2 4 68 2 4 68 2 4 68
10
102
103
104
CLOCK INPUT FREQUENCY (fCL) (kHz)
FIGURE 8. TYPICAL DYNAMIC POWER DISSIPATION AS A FUNCTION OF CLOCK FREQUENCY
Chip Dimensions and Pad Layout
Dimensions in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10-3 inch).
METALLIZATION: Thickness: 11kÅ 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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