Q67060-S6101-A4 View Datasheet(PDF) - Siemens AG

Part Name

Description

Manufacturer

Q67060-S6101-A4

Smart Highside Power Switch

Siemens AG 

BTS 410 D2

Pin

Symbol

Function

1

GND

- Logic ground

2

IN

I Input, activates the power switch in case of logical high signal

3

Vbb

+ Positive power supply voltage,

the tab is shorted to this pin

4

ST

S Diagnostic feedback, low on failure

5

OUT

O Output to the load

(Load, L)

Maximum Ratings at Tj = 25 °C unless otherwise specified

Parameter

Symbol

Supply voltage (overvoltage protection see page 3)

Load dump protection2) VLoadDump = UA + Vs, UA = 13.5 V

RI3)= 2 Ω, RL= 6.6 Ω, td= 400 ms, IN= low or high

Vbb

VLoad dump4)

Load current (Short circuit current, see page 4)

IL

Operating temperature range

Tj

Storage temperature range

Tstg

Power dissipation (DC), TC ≤ 25 °C

Ptot

Inductive load switch-off energy dissipation, single pulse

Vbb = 12V, Tj,start = 150°C, TC = 150°C const.

IL = 1.8 A, ZL = 2.3 H, 0 Ω: EAS

Electrostatic discharge capability (ESD)

IN: VESD

(Human Body Model)

all other pins:

acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993

Input voltage (DC)

VIN

Current through input pin (DC)

IIN

Current through status pin (DC)

IST

see internal circuit diagrams page 6

Values Unit

65 V

100 V

self-limited A

-40 ...+150 °C

-55 ...+150

50 W

4.5

J

1 kV

2

-0.5 ... +6 V

±5.0 mA

±5.0

Thermal Characteristics

Parameter and Conditions

Symbol

Thermal resistance

chip - case: RthJC

junction - ambient (free air): RthJA

SMD version, device on PCB5):

Values

Unit

min typ max

--

-- 2.5 K/W

--

-- 75

-- 35

--

2) Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins, e.g. with a

150 Ω resistor in the GND connection and a 15 kΩ resistor in series with the status pin. A resistor for the

protection of the input is integrated.

3) RI = internal resistance of the load dump test pulse generator

4) VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839

5) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70µm thick) copper area for Vbb

connection. PCB is vertical without blown air.

Semiconductor Group

2

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