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BTA/BTB16-XXXSW View Datasheet(PDF) - STMicroelectronics

Part Name
Description
Manufacturer
BTA/BTB16-XXXSW
ST-Microelectronics
STMicroelectronics ST-Microelectronics
BTA/BTB16-XXXSW Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
BTA16, BTB16, T1610, T1635
Characteristics
Figure 7. Non-repetitive surge peak on-state Figure 8. Relative variation of gate trigger
current for a sinusoidal
current
ITSM(A), I2t (A2s)
3000
dI/dt limitation:
50A/µs
1000
Tj initial=25°C
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
2.5
holding current and latching current versus junction
temperature (typical values)
2.0
IGT
ITSM
1.5
IH & IL
1.0
I2t
0.5
100 pulse with width tp < 10 ms and corresponding value of I2t tp(ms)
0.0
Tj(°C)
0.01
0.10
1.00
10.00
-40 -20
0
20
40
60
80 100 120 140
Figure 9.
Relative variation of critical rate of Figure 10. Relative variation of critical rate of
decrease of main current versus
decrease of main current versus
(dV/dt)c (typical values)
(dV/dt)c (typical values)
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.0
Snubberless and Logic level types
1.8
SW
1.6
C
B
1.4
1.2
T1635/CW/BW
1.0
0.8
0.6
0.4
0.1
(dV/dt)c (V/µs)
1.0
10.0
100.0
(dI/dt)c [Tj] / (dI/dt)c [Tj specified]
6
5
4
3
2
1
Tj(°C)
0
0
25
50
75
Standard types
100
125
Figure 11. D2PAK thermal resistance junction to ambient versus copper surface under tab
(printed circuit board FR4, copper thickness: 35 µm)
Rth(j-a)(°C/W)
80
70
60
50
D2PAK
40
30
20
10
S(cm²)
0
0
4
8
12
16
20
24
28
32
36
40
Doc ID 7471 Rev 9
5/10
 

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