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AT34C02C View Datasheet(PDF) - Atmel Corporation

Part Name
Description
Manufacturer
AT34C02C Datasheet PDF : 18 Pages
First Prev 11 12 13 14 15 16 17 18
8A2 – TSSOP
3 21
Pin 1 indicator
this corner
E1
E
L1
N
Top View
A
b
e
A2
D
Side View
L
End View
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
D
E
E1
A
A2
b
e
L
L1
MIN
2.90
4.30
0.80
0.19
0.45
NOM
3.00
6.40 BSC
4.40
1.00
0.65 BSC
0.60
1.00 REF
MAX
3.10
4.50
1.20
1.05
0.30
0.75
NOTE
2, 5
3, 5
4
Notes:
1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
5/30/02
2325 Orchard Parkway
R San Jose, CA 95131
TITLE
8A2, 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
DRAWING NO. REV.
8A2
B
16 AT34C02C
5242B–SEEPR–01/09
 

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