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SP3220EUEA View Datasheet(PDF) - Signal Processing Technologies

Part Name
Description
Manufacturer
SP3220EUEA
Sipex
Signal Processing Technologies Sipex
SP3220EUEA Datasheet PDF : 21 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
Receivers
The receiver converts EIA/TIA-232 levels to TTL or
CMOS logic output levels. The receiver has an
inverting high-impedance output. This receiver
output (RxOUT) is at high-impedance when the
enable control EN = HIGH. In the shutdown mode,
the receiver can be active or inactive. EN has no
effect on TxOUT. The truth table logic of the
SP3220E/EB/EU driver and receiver outputs can
be found in Table 2.
Since receiver input is usually from a transmission
line where long cable lengths and system
interference can degrade the signal, the inputs
have a typical hysteresis margin of 300mV.
This ensures that the receiver is virtually
immune to noisy transmission lines. Should an
input be left unconnected, a 5k1 pulldown
resistor to ground will commit the output of the
receiver to a HIGH state.
CHARGE PUMP
The charge pump is a Sipex–patented design
(U.S. 5,306,954) and uses a unique approach
compared to older less–efficient designs. The
charge pump still requires four external
capacitors, but uses a four–phase voltage shifting
technique to attain symmetrical 5.5V power sup-
plies. The internal power supply consists of a
regulated dual charge pump that provides output
voltages 5.5V regardless of the input voltage (VCC)
over the +3.0V to +5.5V range.
SHDN EN TxOUT RxOUT
0
0
Tri-state Active
0
1
Tri-state Tri-state
1
0
Active
Active
1
1
Active Tri-state
Table 2. Truth Table Logic for Shutdown and
Enable Control
In most circumstances, decoupling the power
supply can be achieved adequately using a 0.1µF
bypass capacitor at C5 (refer to Figure 11).
In applications that are sensitive to power-
supply noise, decouple VCC to ground with a ca-
pacitor of the same value as charge-pump capaci-
tor C1. Physically connect bypass capacitors as
close to the IC as possible.
The charge pumps operate in a discontinuous
mode using an internal oscillator. If the output
voltages are less than a magnitude of 5.5V, the
charge pumps are enabled; if the output voltages
exceed a magnitude of 5.5V, the charge pumps
are disabled. This oscillator controls the four
phases of the voltage shifting. A description of
each phase follows.
Phase 1
— V charge storage — During this phase of the
SS
clock cycle, the positive side of capacitors C1 and
C2 are initially charged to VCC. Cl+ is then switched
to
GND
and
the
charge
in
C
1
is
transferred to C2–. Since C2+ is connected to VCC,
the voltage potential across capacitor C2 is now 2
times VCC.
Phase 2
— VSS transfer — Phase two of the clock
connects the negative terminal of C2 to the VSS
storage capacitor and the positive terminal of C2 to
GND. This transfers a negative generated voltage
to C3. This generated voltage is
regulated to a minimum voltage of -5.5V.
Simultaneous with the transfer of the voltage to C3,
the positive side of capacitor C1 is switched to VCC
and the negative side is connected to GND.
Phase 3
— VDD charge storage — The third phase of the
clock is identical to the first phase — the charge
transferred in C1 produces –VCC in the negative
terminal of C1, which is applied to the negative side
of capacitor C . Since C + is at V , the voltage
2
2
CC
potential across C2 is 2 times VCC.
Date: 8/30/05
Date: 8/22/05
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
11
SP3220E/EB/EU High ESD RS-232 Driver/Receiver
© Copyright 2005 Sipex Corporation
© Copyright 2005 Sipex Corporation
 

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