AT24CS01-XHM-T View Datasheet(PDF) - Atmel Corporation

Part Name

Description

Manufacturer

AT24CS01-XHM-T

I2C-Compatible (2-wire) Serial EEPROM with a Unique, Factory Programmed 128-bit Serial Number

Atmel Corporation 

14.4 5TS1 — 5-lead SOT23

e1

5

4

C

E1

E

CL

1

2

3

TOP VIEW

b

L1

END VIEW

A2 A

SEATING

PLANE

e

A1

D

SIDE VIEW

1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash,

protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does

not include interlead flash or protrusion. Interlead flash or protrusion shall not

exceed 0.15 mm per side.

2. The package top may be smaller than the package bottom. Dimensions D and E1

are determined at the outermost extremes of the plastic body exclusive of mold

flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch

between the top and bottom of the plastic body.

3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15

mm from the lead tip.

4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion

shall be 0.08 mm total in excess of the "b" dimension at maximum material

condition. The dambar cannot be located on the lower radius of the foot. Minimum

space between protrusion and an adjacent lead shall not be less than 0.07 mm.

This drawing is for general information only. Refer to JEDEC

Drawing MO-193, Variation AB for additional information.

SYMBOL

A

A1

A2

c

D

E

E1

L1

e

e1

b

COMMON DIMENSIONS

(Unit of Measure = mm)

MIN NOM MAX

-

- 1.00

0.00 - 0.10

0.70 0.90 1.00

0.08 - 0.20

2.90 BSC

2.80 BSC

1.60 BSC

0.60 REF

0.95 BSC

1.90 BSC

0.30 - 0.50

NOTE

3

1,2

1,2

1,2

3,4

Package Drawing Contact:

packagedrawings@atmel.com

TITLE

5TS1, 5-lead 1.60mm Body, Plastic Thin

Shrink Small Outline Package (Shrink SOT)

5/31/12

GPC DRAWING NO. REV.

TSZ

5TS1

D

Atmel AT24CS01/02 [PRELIMINARY DATASHEET] 21

8815A–SEEPR–6/12

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