ADV7441ABSTZ-5P1 View Datasheet(PDF) - Analog Devices
Part Name
Description
Manufacturer
ADV7441ABSTZ-5P1
Analog Devices
ADV7441ABSTZ-5P1 Datasheet PDF : 28 Pages
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ADV7441A
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
AVDD to AGND
DVDD to DGND
PVDD to PGND
DVDDIO to DGND
CVDD to CGND
TVDD to TGND
DVDDIO to AVDD
DVDDIO to TVDD
DVDDIO to DVDD
CVDD to DVDD
PVDD to DVDD
AVDD to CVDD
AVDD to PVDD
AVDD to DVDD
AVDD to TVDD
TVDD to DVDD
Digital Inputs
Voltage to DGND
Digital Outputs
Voltage to DGND
Analog Inputs
Voltage to AGND
Maximum Junction
Temperature (TJ_MAX)
Storage Temperature Range
Infrared Reflow,
Soldering (20 sec)
Rating
2.2 V
2.2 V
2.2 V
4V
2.2 V
4V
−0.3 V to +3.6 V
−3.6 V to +3.6 V
−2 V to +2 V
−2 V to +0.3 V
−2 V to +0.3 V
−2 V to +2 V
−2 V to +2 V
−2 V to +0.3 V
−3.6 V to +0.3 V
−2 V to +2 V
DGND − 0.3 V to DVDDIO + 0.3 V
DGND − 0.3 V to DVDDIO + 0.3 V
AGND − 0.3 V to AVDD + 0.3 V
125°C
−65°C to +150°C
260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 6.
Package Type
144-Lead LQFP (ST-144)
ΨJT1
Unit
1.62
°C/W
1 Junction-to-package surface thermal resistance.
PACKAGE THERMAL PERFORMANCE
To reduce power consumption during ADV7441A operation,
turn off unused ADCs.
On a four-layer PCB that includes a solid ground plane, the
value of θJA is 25.3°C/W. However, due to variations within the
PCB metal and, therefore, variations in PCB heat conductivity,
the value of θJA may differ for various PCBs.
The most efficient measurement technique is to use the surface
temperature of the package to estimate the die temperature,
because this is not affected by the variance associated with the
value of θJA.
The maximum junction temperature (TJ_MAX) of 125°C must not
be exceeded. The following equation calculates the junction
temperature using the measured surface temperature of the
package and applies only when no heat sink is used on DUT:
TJ_MAX = TS + (ΨJT × WTOTAL)
where:
TS is the surface temperature of the package expressed in degrees
Celsius.
ΨJT is the junction-to-package surface thermal resistance.
WTOTAL = {(AVDD × IAVDD) + (DVDD × IDVDD) +
(DVDDIO × IDVDDIO) + (PVDD × IPVDD) +
(CVDD × ICVDD) + (TVDD × ITVDD)}.
Contact an Analog Devices, Inc., sales representative or send an
e-mail to video.products@analog.com for more information on
package thermal performance.
ESD CAUTION
Rev. B | Page 10 of 28
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