ADM1166ACPZ-REEL View Datasheet(PDF) - Analog Devices

Part Name

Description

Manufacturer

ADM1166ACPZ-REEL

Super Sequencer with Margining Control and Nonvolatile Fault Recording

Analog Devices 

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Voltage on VH Pin

Voltage on VPx Pins

Voltage on VXx Pins

Voltage on AUX1, AUX2 Pins

Voltage on A0, A1 Pins

Voltage on REFIN, REFOUT Pins

Voltage on VDDCAP, VCCP Pins

Voltage on DACx Pins

Voltage on PDOx Pins

Voltage on SDA, SCL Pins

Voltage on GND, AGND, PDOGND, REFGND Pins

Input Current at Any Pin

Package Input Current

Maximum Junction Temperature (TJ max)

Storage Temperature Range

Lead Temperature

Soldering Vapor Phase, 60 sec

ESD Rating, All Pins

Rating

16 V

7V

−0.3 V to +6.5 V

−0.3 V to +5 V

−0.3 V to +7 V

5V

6.5 V

6.5 V

16 V

7V

−0.3 V to +0.3 V

±5 mA

±20 mA

150°C

−65°C to +150°C

215°C

2000 V

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ADM1166

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA

Unit

40-Lead LFCSP

26.5

°C/W

48-Lead TQFP

50

°C/W

ESD CAUTION

Rev. 0 | Page 7 of 32

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