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AD9148BBPZ View Datasheet(PDF) - Analog Devices

Part Name
Description
Manufacturer
AD9148BBPZ Datasheet PDF : 72 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
AD9148
Table 8. Thermal Resistance and Maximum Power
PCB
Package Type
TA (°C) PCB Layers PCB Vias External Heat Sink1
196-ball CSP_BGA 85
12
25
No
196-ball CSP_BGA 85
12
25
Yes
196-ball BGA_ED 85
12
25
No
196-ball BGA_ED 85
12
25
Yes
1 Heat sink is used in the thermal model: 13 mm × 13 mm, 15 mm tall.
Case
CSP_BGA
CSP_BGA
BGA_ED
BGA_ED
Data Sheet
TJ (°C)
125
125
125
125
θJA (°C/W)
18.0
16.0
15.0
14.0
Maximum
Power (W)
2.22
2.50
2.67
2.86
Table 9. Power vs. fDAC Rate and Functionality
Maximum Power (W)
2.22
2.50
2.67
2.86
Package
CSP_BGA
CSP_BGA
BGA_EP
BGA_EP
Heat-Sink Combination2
No
Yes
No
Yes
1 Typical maximum fDAC rate with inverse sinc filter off.
2 Heat sink is used in the thermal model: 13 mm × 13 mm, 15 mm tall.
Maximum fDAC (MSPS)1
Coarse Modulation
Fine Modulation (NCO)
PLL Off
PLL On
PLL Off
PLL On
820
740
695
630
950
875
810
740
1000
945
870
810
1000
1000
940
870
Rev. B | Page 10 of 72
 

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