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AD9122-M5375-EBZ View Datasheet(PDF) - Analog Devices

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Description
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AD9122-M5375-EBZ Datasheet PDF : 56 Pages
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ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
AVDD33
IOVDD
DVDD18, CVDD18
AVSS
EPAD
CVSS
DVSS
FSADJ, REFIO,
IOUT1P/IOUT1N,
IOUT2P/IOUT2N
D[15:0]P/D[15:0]N,
FRAMEP/FRAMEN,
DCIP/DCIN
DACCLKP/DACCLKN,
REFCLKP/REFCLKN
RESET, IRQ, CS, SCLK,
SDIO, SDO
Junction Temperature
Storage Temperature
Range
With
Respect To
AVSS, EPAD,
CVSS, DVSS
AVSS, EPAD,
CVSS, DVSS
AVSS, EPAD,
CVSS, DVSS
EPAD, CVSS,
DVSS
AVSS, CVSS,
DVSS
AVSS, EPAD,
DVSS
AVSS, EPAD,
CVSS
AVSS
EPAD, DVSS
DVSS
EPAD, DVSS
Rating
−0.3 V to +3.6 V
−0.3 V to +3.3 V
−0.3 V to +2.1 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to AVDD33 + 0.3 V
−0.3 V to DVDD18 + 0.3 V
−0.3 V to CVDD18 + 0.3 V
−0.3 V to IOVDD + 0.3 V
125°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AD9122
THERMAL RESISTANCE
The exposed paddle (EPAD) must be soldered to the ground
plane for the 72-lead, LFCSP. The EPAD performs as an
electrical and thermal connection to the board.
Typical θJA, θJB, and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation effectively reducing θJA and θJB.
Table 7. Thermal Resistance
Package
θJA θJB θJC Unit Conditions
72-Lead LFCSP_VQ 20.7 10.9 1.1 °C/W EPAD soldered
ESD CAUTION
Rev. 0 | Page 7 of 56
 

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