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AD8004AR-14_99 データシートの表示(PDF) - Analog Devices

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AD8004AR-14_99 Quad 3000 V/ms, 35 mW Current Feedback Amplifier ADI
Analog Devices ADI
AD8004AR-14_99 Datasheet PDF : 16 Pages
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AD8004
ABSOLUTE MAXIMUM RATINGS1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V
Internal Power Dissipation2
Plastic DIP Package (N) . . . . . . . . . Observe Derating Curves
Small Outline Package (R) . . . . . . . . Observe Derating Curves
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . ± VS
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ± 2.5 V
Output Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Storage Temperature Range (N, R) . . . . . . . –65°C to +125°C
Operating Temperature Range (A Grade) . . . – 40°C to +85°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Specification is for device in free air:
14-Lead Plastic DIP Package: θJA = 90°C/W
14-Lead SOIC Package: θJA = 140°C/W
ORDERING GUIDE
Model
Temperature Package
Range
Description
Package
Option
AD8004AN
– 40°C to +85°C
AD8004AR-14
– 40°C to +85°C
AD8004AR-14-REEL – 40°C to +85°C
AD8004AR-14-REEL7 – 40°C to +85°C
14-Lead Plastic DIP
14-Lead SOIC
13" Tape and Reel
7" Tape and Reel
N-14
R-14
R-14
R-14
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8004 is limited by the associated rise in junction tempera-
ture. The maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition tem-
perature of the plastic, approximately +150°C. Exceeding this
limit temporarily may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of +175°C for an extended
period can result in device failure.
While the AD8004 is internally short circuit protected, this may
not be sufficient to guarantee that the maximum junction tem-
perature is not exceeded under all conditions. To ensure proper
operation, it is necessary to observe the maximum power derat-
ing curves (shown below in Figure 3).
2.0
TJ = +150؇C
14-LEAD PLASTIC DIP
PACKAGE
1.5
1.0
14-LEAD SOIC
PACKAGE
0.5
0
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE – ؇C
Figure 3. Maximum Power Dissipation vs. Temperature
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8004 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. B
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