A42MX09-3BG100I View Datasheet(PDF) - Microsemi Corporation

Part Name

Description

Manufacturer

A42MX09-3BG100I

40MX and 42MX FPGA Families

Microsemi Corporation 

40MX and 42MX FPGA Families

Ordering Information

A42MX16 _ 1

PQ

G

100

ES

Application (Temperature Range)

Blank = Commercial (0 to +70°C)

I = Industrial (–40 to +85°C)

M = Military (–55 to +125°C)

B = MIL-STD-883

A = Automotive (–40 to +125°C)

Package Lead Count

Lead-Free Packaging

Blank = Standard Packaging

G = RoHS Compliant Packaging

Package Type

PL = Plastic Leaded Chip Carrier

PQ = Plastic Quad Flat Pack

TQ = Thin (1.4 mm) Quad Flat Pack

VQ = Very Thin (1.0 mm) Quad Flat Pack

BG = Plastic Ball Grid Array

CQ =Ceramic Quad Flat Pack

Speed Grade

Blank = Standard Speed

–1 = Approximately 15% Faster than Standard

–2 = Approximately 25% Faster than Standard

–3 = Approximately 35% Faster than Standard

–F = Approximately 40% Slower than Standard

Part Number

A40MX02 = 3,000 System Gates

A40MX04 = 6,000 System Gates

A42MX09 = 14,000 System Gates

A42MX16 = 24,000 System Gates

A42MX24 = 36,000 System Gates

A42MX36 = 54,000 System Gates

Plastic Device Resources

User I/Os

Device

PLCC PLCC PLCC PQFP PQFP PQFP PQFP VQFP VQFP TQFP PBGA

44-Pin 68-Pin 84-Pin 100-Pin 160-Pin 208-Pin 240-Pin 80-Pin 100-Pin 176-Pin 272-Pin

A40MX02

34

57

–

57

–

–

–

57

–

–

–

A40MX04

34

57

69

69

–

–

–

69

–

–

–

A42MX09

–

–

72

83

101

–

–

–

83

104

–

A42MX16

–

–

72

83

125

140

–

–

83

140

–

A42MX24

–

–

72

–

125

176

–

–

–

150

–

A42MX36

–

–

–

–

–

176

202

–

–

–

202

Note: Package Definitions

PLCC = Plastic Leaded Chip Carrier, PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, VQFP = Very Thin Quad

Flat Pack, PBGA = Plastic Ball Grid Array

ii

Revision 11

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