M1A3P400-PQG208ES View Datasheet(PDF) - Microsemi Corporation
Part Name
Description
Manufacturer
M1A3P400-PQG208ES
Microsemi Corporation
M1A3P400-PQG208ES Datasheet PDF : 220 Pages
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ProASIC3 DC and Switching Characteristics
Table 2-11 • Summary of I/O Output Buffer Power (per pin) – Default I/O Software Settings1
Applicable to Advanced I/O Banks
Single-Ended
CLOAD (pF)
VCCI (V)
Static Power
PDC3 (mW)2
Dynamic Power
PAC10 (µW/MHz)3
3.3 V LVTTL / 3.3 V LVCMOS
35
3.3
3.3 V LVCMOS Wide Range4
35
3.3
–
468.67
–
468.67
2.5 V LVCMOS
35
2.5
–
267.48
1.8 V LVCMOS
35
1.8
–
149.46
1.5 V LVCMOS
(JESD8-11)
35
1.5
–
103.12
3.3 V PCI
10
3.3
–
201.02
3.3 V PCI-X
10
3.3
–
201.02
Differential
LVDS
–
2.5
7.74
88.92
LVPECL
–
3.3
19.54
166.52
Notes:
1. Dynamic power consumption is given for standard load and software default drive strength and output slew.
2. PDC3 is the static power (where applicable) measured on VCCI.
3. PAC10 is the total dynamic power measured on VCC and VCCI.
4. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B specification.
Table 2-12 • Summary of I/O Output Buffer Power (Per Pin) – Default I/O Software Settings1
Applicable to Standard Plus I/O Banks
Single-Ended
CLOAD (pF)
VCCI (V)
Static Power
PDC3 (mW)2
Dynamic Power
PAC10 (µW/MHz)3
3.3 V LVTTL / 3.3 V LVCMOS
35
3.3
3.3 V LVCMOS Wide Range4
35
3.3
–
452.67
–
452.67
2.5 V LVCMOS
35
2.5
–
258.32
1.8 V LVCMOS
35
1.8
–
133.59
1.5 V LVCMOS (JESD8-11)
35
1.5
–
92.84
3.3 V PCI
10
3.3
–
184.92
3.3 V PCI-X
10
3.3
–
184.92
Notes:
1. Dynamic power consumption is given for standard load and software default drive strength and output slew.
2. PDC3 is the static power (where applicable) measured on VMV.
3. PAC10 is the total dynamic power measured on VCC and VMV.
4. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B specification.
2-8
Revision 13
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