M1A3P400-2FGG256Y View Datasheet(PDF) - Microsemi Corporation
Part Name
Description
Manufacturer
M1A3P400-2FGG256Y
Microsemi Corporation
M1A3P400-2FGG256Y Datasheet PDF : 220 Pages
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ProASIC3 Flash Family FPGAs
Package Thermal Characteristics
The device junction-to-case thermal resistivity is jc and the junction-to-ambient air thermal resistivity is
ja. The thermal characteristics for ja are shown for two air flow rates. The absolute maximum junction
temperature is 100°C. EQ 2 shows a sample calculation of the absolute maximum power dissipation
allowed for a 484-pin FBGA package at commercial temperature and in still air.
Maximum Power Allowed = M-----a----x---.---j--u---n---c---t--i-o----n-----t-e----m-----p---.-----(----j-Ca---(-)----–C----M-/-W---a---)-x---.---a---m-----b----i-e---n----t---t--e---m-----p---.----(-----C----)- = 1----0--2-0--0----.-C5-----–--C---7-/--W0-------C-- = 1.463 W·
EQ 2
Table 2-5 • Package Thermal Resistivities
Package Type
Quad Flat No Lead
Device
A3P030
ja
Pin Count jc Still Air 200 ft./min. 500 ft./min. Units
132
0.4 21.4
16.8
15.3
C/W
A3P060
132
0.3 21.2
16.6
15.0
C/W
A3P125
132
0.2 21.1
16.5
14.9
C/W
A3P250
132
0.1 21.0
16.4
14.8
C/W
Very Thin Quad Flat Pack (VQFP)
All devices 100 10.0 35.3
29.4
27.1
C/W
Thin Quad Flat Pack (TQFP)
All devices 144 11.0 33.5
28.0
25.7
C/W
Plastic Quad Flat Pack (PQFP)
All devices
208
8.0 26.1
22.5
20.8
C/W
PQFP with embedded heatspreader All devices
208
3.8 16.2
13.3
11.9
C/W
Fine Pitch Ball Grid Array (FBGA)
See note*
144
3.8 26.9
22.9
21.5
C/W
See note*
256
3.8 26.6
22.8
21.5
C/W
See note*
484
3.2 20.5
17.0
15.9
C/W
A3P1000
144
6.3 31.6
26.2
24.2
C/W
A3P1000
256
6.6 28.1
24.4
22.7
C/W
A3P1000
484
8.0 23.3
19.0
16.7
C/W
Note: *This information applies to all ProASIC3 devices except the A3P1000. Detailed device/package thermal
information will be available in future revisions of the datasheet.
Revision 13
2-5
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