74LVT240SJX View Datasheet(PDF) - Fairchild Semiconductor

Part Name

Description

Manufacturer

74LVT240SJX

Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs

Fairchild Semiconductor 

January 2008

74LVT240, 74LVTH240

Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs

Features

■ Input and output interface capability to systems at

5V VCC

■ Bushold data inputs eliminate the need for external

pull-up resistors to hold unused inputs (74LVTH240),

also available without bushold feature (74LVT240)

■ Live insertion/extraction permitted

■ Power Up/Down high impedance provides glitch-free

bus loading

■ Outputs source/sink –32mA/+64mA

■ Functionally compatible with the 74 series 240

■ Latch-up performance exceeds 500mA

■ ESD performance:

– Human-body model > 2000V

– Machine model > 200V

– Charged-device model > 1000V

General Description

The LVT240 and LVTH240 are inverting octal buffers

and line drivers designed to be employed as memory

address drivers, clock drivers and bus oriented transmit-

ters or receivers which provides improved PC board

density.

The LVTH240 data inputs include bushold, eliminating

the need for external pull-up resistors to hold unused

inputs.

These octal buffers and line drivers are designed for low-

voltage (3.3V) VCC applications, but with the capability to

provide a TTL interface to a 5V environment. The LVT240

and LVTH240 are fabricated with an advanced BiCMOS

technology to achieve high speed operation similar to 5V

ABT while maintaining low power dissipation.

Ordering Information

Package

Order Number Number

Package Description

74LVT240WM

74LVT240SJ

74LVT240MSA

M20B

M20D

MSA20

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide

20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide

74LVT240MTC

MTC20

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm

Wide

74LVTH240WM

74LVTH240SJ

74LVTH240MSA

M20B

M20D

MSA20

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide

20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide

74LVTH240MTC

MTC20

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm

Wide

Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.

All packages are lead free per JEDEC: J-STD-020B standard.

©1999 Fairchild Semiconductor Corporation

74LVT240, 74LVTH240 Rev. 1.5.0

www.fairchildsemi.com

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