74LVT16245BBQ View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
Manufacturer
74LVT16245BBQ Datasheet PDF : 19 Pages
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NXP Semiconductors
74LVT16245B; 74LVTH16245B
3.3 V 16-bit transceiver; 3-state
3. Ordering information
Table 1. Ordering information
Type number
Package
Temperature range Name
Description
Version
74LVT16245BDL
74LVTH16245BDL
−40 °C to +85 °C
SSOP48
plastic shrink small outline package; 48 leads;
body width 7.5 mm
SOT370-1
74LVT16245BDGG −40 °C to +85 °C
74LVTH16245BDGG
TSSOP48 plastic thin shrink small outline package; 48 leads; SOT362-1
body width 6.1 mm
74LVT16245BEV
−40 °C to +85 °C
VFBGA56 plastic very thin fine-pitch ball grid array package; SOT702-1
56 balls; body 4.5 × 7 × 0.65 mm
74LVT16245BBQ −40 °C to +85 °C
74LVTH16245BBQ
HXQFN60U plastic thermal enhanced extremely thin quad flat SOT1134-1
package; no leads; 60 terminals; UTLP based;
body 4 × 6 × 0.5 mm
4. Functional diagram
1DIR
1A0
1A1
1A2
1A3
1A4
1A5
1A6
1A7
2DIR
1OE
2A0
1B0
2A1
1B1
2A2
1B2
2A3
1B3
2A4
1B4
2A5
1B5
2A6
1B6
2A7
1B7
Pin numbers are shown for SSOP48 and TSSOP48 packages only.
Fig 1. Logic symbol
2OE
2B0
2B1
2B2
2B3
2B4
2B5
2B6
2B7
001aaa789
74LVT_LVTH16245B_7
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 07 — 29 March 2010
© NXP B.V. 2010. All rights reserved.
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