74LVT374MTC View Datasheet(PDF) - Fairchild Semiconductor

Part Name

Description

Manufacturer

74LVT374MTC

Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs

Fairchild Semiconductor 

January 2008

74LVT374, 74LVTH374

Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs

Features

■ Input and output interface capability to systems at

5V VCC

■ Bus-Hold data inputs eliminate the need for external

pull-up resistors to hold unused inputs (74LVTH374),

also available without bushold feature (74LVT374)

■ Live insertion/extraction permitted

■ Power Up/Down high impedance provides glitch-free

bus loading

■ Outputs source/sink –32mA/+64mA

■ Functionally compatible with the 74 series 374

■ Latch-up performance exceeds 500mA

■ ESD performance:

– Human-body model > 2000V

– Machine model > 200V

– Charged-device model > 1000V

General Description

The LVT374 and LVTH374 are high-speed, low-power

octal D-type flip-flops featuring separate D-type inputs

for each flip-flop and 3-STATE outputs for bus-oriented

applications. A buffered Clock (CP) and Output Enable

(OE) are common to all flip-flops.

The LVTH374 data inputs include bushold, eliminating

the need for external pull-up resistors to hold unused

inputs.

These octal flip-flops are designed for low-voltage (3.3V)

VCC applications, but with the capability to provide a TTL

interface to a 5V environment. The LVT374 and

LVTH374 are fabricated with an advanced BiCMOS

technology to achieve high speed operation similar to 5V

ABT while maintaining low power dissipation.

Ordering Information

Order Number

Package

Number

Package Description

74LVT374WM

74LVT374SJ

74LVT374MTC

74LVTH374WM

74LVTH374SJ

74LVTH374MTC

M20B

M20D

MTC20

M20B

M20D

MTC20

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide

20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm

Wide

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide

20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm

Wide

Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.

All packages are lead free per JEDEC: J-STD-020B standard.

©1999 Fairchild Semiconductor Corporation

74LVT374, 74LVTH374 Rev. 1.5.0

www.fairchildsemi.com

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