Philips Semiconductors
74LVT125; 74LVTH125
3.3 V quad buffer; 3-state
13. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
y
Z
14
pin 1 index
1
e
E
A
X
c
HE
vM A
8
A2
A1
7
bp
wM
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT max. A1
A2
A3
bp
c
D(1) E(1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25 0.25
0.1
0.7
0.3
8o
inches
0.069
0.010
0.004
0.057
0.049
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.05
0.244
0.228
0.041
0.039
0.016
0.028
0.024
0.01
0.01
0.004
0.028
0.012
0o
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
OUTLINE
VERSION
SOT108-1
IEC
076E06
REFERENCES
JEDEC
JEITA
MS-012
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 9. Package outline SOT108-1 (SO14)
74LVT_LVTH125_6
Product data sheet
Rev. 06 — 6 March 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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