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74LV32PW View Datasheet(PDF) - NXP Semiconductors.

Part Name
Description
Manufacturer
74LV32PW
NXP
NXP Semiconductors. NXP
74LV32PW Datasheet PDF : 15 Pages
First Prev 11 12 13 14 15
NXP Semiconductors
74LV32
Quad 2-input OR gate
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
c
y
Z
14
8
E
A
X
HE
vM A
pin 1 index
1
e
7
bp
wM
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1) E (2) e
HE
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT402-1
MO-153
L
Lp
Q
v
w
y
Z (1) θ
1
0.75 0.4
0.50 0.3
0.2 0.13 0.1
0.72
0.38
8o
0o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
Fig 11. Package outline SOT402-1 (TSSOP14)
74LV32_3
Product data sheet
Rev. 03 — 9 November 2007
© NXP B.V. 2007. All rights reserved.
11 of 15
 

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