4N31SR2M View Datasheet(PDF) - Fairchild Semiconductor
Part Name
Description
Manufacturer
4N31SR2M Datasheet PDF : 13 Pages
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Reflow Soldering Profile
Black Package, No Suffix
300
215°C, 10–30 s
250
225 C peak
200
150
100
Time above 183°C, 60–150 sec
50
Ramp up = 3C/sec
0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5
Time (Minute)
• Peak reflow temperature: 225°C (package surface temperature)
• Time of temperature higher than 183°C for 60–150 seconds
• One time soldering reflow is recommended
White Package, -M Suffix
300
280
260
240
220
200
180
160
°C 140
120
100
80
60
40
20
0
0
260°C
>245°C = 42 Sec
Time above
183°C = 90 Sec
1.822°C/Sec Ramp up rate
33 Sec
60
120
180
Time (s)
270
360
©2006 Fairchild Semiconductor Corporation
4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1
12
www.fairchildsemi.com
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