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2-111506-4 View Datasheet(PDF) - Tyco Electronics

Part Name2-111506-4 MACOM
Tyco Electronics MACOM
DescriptionRibbon Cable Interconnect Solutions
2-111506-4 Datasheet PDF : 100 Pages
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Ribbon Cable Interconnect Solutions
Board-to-Board Vertical Receptacles and Headers
Product Facts
I Surface-mount products for
parallel board-to-board
applications, as well as
right-angle board-to-board
and cable-to-board
applications
I High density .050 x .050
[1.27x1.27] centerline grid
I Three board-to-board stack
heights: .250 [6.35], .320
[8.13] and .390 [9.91]
I Non-protrusive metallic
holddowns
I Reliable dual beam
receptacle contacts for
redundant contact
I Duplex plated receptacle
and post contacts; gold
plated on mating areas,
tin plated on tails
I Compatible with standard
surface-mount processing
(VPR and IR)
I Receptacle and header allow
for drainage of
processing fluids
I Tape and reel packaging
available. Contact
TE for details
I Polarized header and
receptacle assemblies
I Sizes of 10, 20, 30, 40, 50,
60, 70, 80 and 100 positions
I Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File No. E28476 R
I Certified by
Canadian Standards
Association
R
File No. LR7189
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
for parallel board-to-board
stacking in high density
applications.
Right-angle board-to-board
and cable-to-board
applications are also
possible, since the vertical
receptacles also mate with
non-latching right-angle
headers (page 24) and the
vertical headers also mate
with non-latching cable
connectors.
Available are double row,
vertical shrouded headers
and receptacles in sizes
ranging from 10 through
100 positions (in 10 position
increments).
Parallel board-to-board
stack heights of .250 [6.35],
.320 [8.13] and .390 [9.91]
are achievable by selection
of the appropriate header.
The receptacle is the same
for all three stack height
headers.
Non-protrusive metallic
holddowns are designed for
use in .062 [1.57] or thicker
PC boards and allow
surface mounting to both
sides of the board. In
addition to providing
retention during processing,
the holddowns are soldered
during reflow and therefore
provide
long-term strain relief for
the solder joints.
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
to be compatible with
standard surface-mount
processes; IR (infrared) and
VPR (vapor phase reflow).
The surface-mount
connectors have been
designed so that
dimensioning, tolerances,
referenced datums,
Non-Protrusive
Metallic Holddowns
holddown characteristics
and packaging methods
result in a system that is
compatible with robotic
assembly.
The headers and receptacles
feature polarization to
prevent misalignment.
Three Board Stack Heights
.250±.006
[6.35±0.15]
.320±.006
[8.13±0.15]
.390±.006
[9.91±0.15]
Catalog 82012
Revised 4-12
www.te.com
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Dimensions are in inches
and millimeters unless
otherwise specified.
USA: +1 (800) 522-6752
Canada: +1 (905) 475-6222
Mexico/C. Am.: +52 (0) 55-1106-0800
Latin/S. Am.: +54 (0) 11-4733-2200
Germany: +49 (0) 6251-133-1999
19
UK: +44 (0) 800-267666
France: +33 (0) 1-3420-8686
Netherlands: +31 (0) 73-6246-999
China: +86 (0) 400-820-6015
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