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LM2940IMPX-8.0 データシートの表示(PDF) - National ->Texas Instruments

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LM2940IMPX-8.0 1A Low Dropout Regulator National-Semiconductor
National ->Texas Instruments National-Semiconductor
LM2940IMPX-8.0 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
HEATSINKING LLP PACKAGE PARTS
The value of θJA for the LLP package is specifically dependent
on PCB trace area, trace material, and the number of layers
and thermal vias. It is recommended that a minimum of 6
thermal vias be placed under the center pad to improve ther-
mal performance.
For techniques for improving the thermal resistance and pow-
er dissipation for the LLP package, please refer to Application
Note AN-1187.
882241
FIGURE 6. Maximum Power Dissipation vs. TA for the
SOT-223 Package
15
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