Electronic component search and free download site.
Transistors,MosFET ,Diode,Integrated circuits

OPA2836 View Datasheet(PDF) - Texas Instruments

Part NameDescriptionManufacturer
OPA2836 Very-Low-Power, Rail-to-Rail Out, Negative Rail In, Voltage-Feedback Operational Amplifiers TI
Texas Instruments TI
OPA2836 Datasheet PDF : 59 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
www.ti.com
7 Specifications
OPA836, OPA2836
SLOS712I – JANUARY 2011 – REVISED OCTOBER 2016
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
VS– to VS+
VI
VID
II
IO
TJ
TA
Tstg
Supply voltage
Input voltage
Differential input voltage
Continuous input current
Continuous output current
Continuous power dissipation
Maximum junction temperature
Operating free-air temperature
Storage temperature
MIN
MAX
5.5
VS– – 0.7
VS+ + 0.7
1
0.85
60
See Thermal Information: OPA836
and
Thermal Information: OPA2836
150
–40
125
–65
150
UNIT
V
V
V
mA
mA
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
Machine model
VALUE
±6000
±1000
±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VS+
Single supply voltage
TA
Ambient temperature
MIN
NOM
MAX UNIT
2.5
5
5.5
V
–40
25
125
°C
7.4 Thermal Information: OPA836
OPA836
THERMAL METRIC(1)
DBV (SOT23-6)
RUN (WQFN-
10)
UNIT
6 PINS
10 PINS
RθJA
RθJC(top)
RθJB
ψJT
ψJB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
194
129.2
39.4
25.6
38.9
145.8
75.1
38.9
13.5
104.5
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).
Copyright © 2011–2016, Texas Instruments Incorporated
Product Folder Links: OPA836 OPA2836
Submit Documentation Feedback
7
Direct download click here

 

Share Link : 
All Rights Reserved© datasheetq.com 2015 - 2019  ] [ Privacy Policy ] [ Request Datasheet  ] [ Contact Us ]