OUTLINE DIMENSIONS
AD8000
4.00 (0.157)
3.90 (0.154)
3.80 (0.150)
5.00 (0.197)
4.90 (0.193)
4.80 (0.189)
8
5
TOP VIEW
1
4
6.20 (0.244)
6.00 (0.236)
5.80 (0.228)
BOTTOM VIEW
(PINS UP)
2.29 (0.092)
2.29 (0.092)
1.27 (0.05)
BSC
1.75 (0.069)
0.50 (0.020) × 45°
0.25 (0.010)
0.25 (0.0098)
1.35 (0.053)
0.10 (0.0039)
COPLANARITY
0.10
SEATING
PLANE
0.51 (0.020)
0.31 (0.012)
8°
0.25 (0.0098) 0° 1.27 (0.050)
0.17 (0.0068)
0.40 (0.016)
COMPLIANT TO JEDEC STANDARDS MS-012
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Figure 54. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP]
Narrow Body (RD-8-1)
Dimensions shown in millimeters and (inches)
3.00
BSC SQ
PIN 1
INDICATOR
TOP
VIEW
2.75
BSC SQ
0.50
0.40
0.60 MAX
0.30
0.45
0.50
BSC
1
8
EXPOSED
PAD
(BOTTOM VIEW)
5
4
1.50
REF
PIN 1
INDICATOR
1.90
1.75
1.60
0.90 12° MAX
0.85
0.80 MAX
0.65 TYP
0.25
1.60
MIN
1.45
1.30
0.80
0.05 MAX
0.02 NOM
SEATING
0.30
PLANE
0.23
0.18
0.20 REF
Figure 55. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body (CP-8-2)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD8000YRDZ1
AD8000YRDZ-REEL1
AD8000YRDZ-REEL71
AD8000YCPZ-R21
AD8000YCPZ-REEL1
AD8000YCPZ-REEL71
Minimum Ordering Quantity
1
2,500
1,000
250
5,000
1,500
Temperature Range
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
Package Description
8-Lead SOIC/EP
8-Lead SOIC/EP
8-Lead SOIC/EP
8-Lead LFCSP
8-Lead LFCSP
8-Lead LFCSP
Branding
HNB
HNB
HNB
Package Option
RD-8-1
RD-8-1
RD-8-1
CP-8-2
CP-8-2
CP-8-2
1 Z = Pb-free part.
Rev. 0 | Page 17 of 20