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CSD17303Q5 View Datasheet(PDF) - Texas Instruments

Part NameCSD17303Q5 Texas-Instruments
Texas Instruments Texas-Instruments
Description30V N-Channel NexFET™ Power MOSFET
CSD17303Q5 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
CSD17303Q5
SLPS246B – JANUARY 2010 – REVISED SEPTEMBER 2010
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise stated)
PARAMETER
Static Characteristics
BVDSS
IDSS
IGSS
VGS(th)
Drain to Source Voltage
Drain to Source Leakage Current
Gate to Source Leakage Current
Gate to Source Threshold Voltage
RDS(on) Drain to Source On Resistance
gfs
Transconductance
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
RG
Series Gate Resistance
Qg
Gate Charge Total (4.5V)
Qgd
Gate Charge Gate to Drain
Qgs
Gate Charge Gate to Source
Qg(th)
Gate Charge at Vth
Qoss
Output Charge
td(on)
Turn On Delay Time
tr
Rise Time
td(off)
Turn Off Delay Time
tf
Fall Time
Diode Characteristics
VSD
Diode Forward Voltage
Qrr
Reverse Recovery Charge
trr
Reverse Recovery Time
TEST CONDITIONS
VGS = 0V, ID = 250mA
VGS = 0V, VDS = 24V
VDS = 0V, VGS = +10/–8V
VDS = VGS, ID = 250mA
VGS = 3V, ID = 25A
VGS = 4.5V, ID = 25A
VGS = 8V, ID = 25A
VDS = 15V, ID = 25A
VGS = 0V, VDS = 15V,
f = 1MHz
VDS = 15V,
IDS = 25A
VDS = 13.7V, VGS = 0V
VDS = 15V, VGS = 4.5V,
IDS = 25A, RG = 2
ISD = 25A, VGS = 0V
VDD = 13.7V, IF = 25A, di/dt = 300A/ms
MIN TYP MAX UNIT
30
V
1 mA
100 nA
0.9 1.1 1.6 V
2.7 3.7 m
2 2.6 m
1.7 2.4 m
114
S
2630 3420 pF
1440 1870 pF
83 108 pF
1.4 2.8
18 23 nC
4
nC
5.6
nC
3
nC
34
nC
11.4
ns
16
ns
27
ns
10.4
ns
0.8
1V
50
nC
33
ns
THERMAL CHARACTERISTICS
(TA = 25°C unless otherwise stated)
PARAMETER
RqJC
RqJA
Thermal Resistance Junction to Case(1)
Thermal Resistance Junction to Ambient(1)(2)
MIN TYP
MAX
1.1
49
UNIT
°C/W
°C/W
(1) RqJC is determined with the device mounted on a 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm ×
3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RqJC is specified by design, whereas RqJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.
2
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Copyright © 2010, Texas Instruments Incorporated
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